Ann: Audio Pixels Integration Stage Update, page-59

""Audio Pixels Holdings Limited (ASX: AKP and OTC: APDXY), a leader in the digital transition of loudspeakers, is pleased to inform its shareholders that together with its MEMS vendors it has completed development of a production process for the previously reported “critical points of contact” layers of the structure.   Management is extremely satisfied with the final outcome derived from originating a reliable and repeatable production process that consistently delivers the targeted performance of the “contact layers”. While this effort proved to be more challenging than originally anticipated nonetheless the fab is now progressing with maximum expediency to implement the process into the production flow, with demonstrable wafers expected in early August. The company is also in the process of filing for patent protection for this unique combination of processes.  ""


As I was saying, through these three statements I believe he's talking about the cohesion of two different elements of the wafer, as previously discussed in most of the "half-arsed" announcements relating to the "half chip" or "half structure".
I think they've solved the problem we expected solved in January, then March, then May, and now it's put to bed. I think MEMS wafers showcasing complete arrays of frequencies and volumes will be ready to showcase in August however the integration with the ASIC will be another patient wait.