Ann: Appendix 4E & Annual Report, page-179

Pretty much as I stated in my previous posts...

(reference source - last release s.......caps...the good doctors comments are at the bottom...)

Memory storage technology developer 4DS Memory (ASX: 4DS) has reported ongoing success in its collaboration with imec, with 4DS claiming its recently processed 300mm wafers (Lot 3) had “demonstrable improvements” over the previous batch Lot 2.

Nanoelectronics and digital research hub imec successfully processed the Lot 3 wafers, which have shown improvements in key areas relevant to developing a storage class memory including speed, endurance and retention.

According to 4DS, wafer D10 in Lot 3 demonstrated the best results, with endurance cycling moving into the tens of millions, better retention and endurance without compromising speed.

Additionally, the company has shown the wafers’ compatibility with the backend-of-line temperatures required for integration with imec’s megabit memory platform.

“We are pleased with our Lot 3 results and we look forward to continuing to work closely with imec to reach the ultimate goal of a 1 megabit chip as soon as possible,” 4DS chief executive officer and managing director Dr Guido Arnout said.

“The data from the next wafer lot will be invaluable as we move closer to that goal,” he added.

Idle speculation .....well you be the judge

Through Lot 4, 4DS expects to further optimise speed, endurance and retention, with results from this batch due before the end of the September quarter.

4DS is also hopeful that Lot 4 will be the final iteration before integration with imec’s megabit memory platform.

Just my opinion
referenced from s...... caps