I don't think they will have extension details worked out until late November/early December.. I think 4DS will use as much time as they can on the existing agreement to produce MB chips on 300 mm wafers and see what performance they can achieve in that time. Pointless making a commitment to a timeframe without further data. Then they will ink the new arrangement with IMEC.
4DS - Anything but Charting, page-3412
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