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4DS - Anything but Charting, page-3424

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    Pol I'm with you.By reading the reports and watching the videos I believe that the integration to the megachip is fairly straight fwd process.They would be working on the process now its interesting that the last announcement said that the last set of wafers were received and analysed by the coy in aug and SEP 2019. This next step in integration which may be underway as we speak will be done on BEOL would not surprise me if will analyse the chip in Nov /,Dec 2019 I'm also hoping for a short term extention to March 2020 because no need for Imec to do any more testing they have done there job. Ide say Take out by mid year 2020 if not earlier may not need a very small CR if the unlisted options are excercised
 
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