2020 BRN Discussion, page-9498

Well I hope everyone has watched the interview with our CEO again.

I have given a lot of thought to what he states about the chip testing and from everything I have read there are four crucial phases once the chip moved from Socionext to TSMC:

1. At TSMC wafer production. Clearly this gets a big tick.

2. At Socionext where the wafer is cut then tested for production faults and chips packaged to go off to BRN. Clearly this gets a big tick.

3. At BRN the completed chip goes through the process of validation which is to see if it will do what it is designed to do. This type of testing is like checking eggs in a box at the supermarket. You check the first egg/chip and then you test the next egg/ chip until you work your way through the whole box. When you find an egg/chip that has a flaw that does not mean that all of the previous eggs/chips is defective. If you are an experienced egg/chip tester you might be testing multiple eggs/chips at once. Once you have checked all the eggs/chips you have completed validation. We are waiting to hear from the company that they have completed this validation phase and are shipping the chips to customers.

4. The final stage is when the proof of concept early access customers receive the chips and connect them to whatever device they want the AKD1000 for and validate that it works to specification with there application. We are waiting for BRN to announce this has occurred.

NOW here is the thing if you listened to the CEO as I suggested he stated that the AKD1000 SoC is with customers who are working assisting with validation.

So I ask two questions:

1. Would you hand a chip that was not testing properly on your bench to your customer to validate?

2. Do we already know the result of phase 3 above?

I have my own opinion DYOR.