Ann: Market Update - Progress Report, page-142

BobF, I respectfully disagree. There is a step which I think is performed prior to packaging called metallisation. Once done, surely a breadboard type of demo setup can be created using one or even four MEMS chips connected to an ASIC. Likewise the ASIC could be connected to a digital sound source of the required voltage. It would require some nifty solder work and the MEMS (one or four) could still be in the wafer. The ASIC would be separate at this pre-packaging stage. Maybe this is what they have done.

In this scenario, demos could be set up in the clean room without waiting for packaging. Of course, any measurements obtained would not enable publication of specifications.

AIMHO