Ann: Appendix 4C - quarterly, page-7

Well, nothing much here we did not know already. Not even crumbs really.

The announcement alludes to but does not indicate whether or not they have solved the problem that caused MEMS devices to rapidly age and fail after a few days (presumably when brought into open air rather than held under a vacuum)?

"... Prior reports including a technical presentation provided at the most recent AGM (May-2020), delineated several challenges attaining defect free, properly functioning MEMS transducers. We specifically highlighted certain fabrication issues that caused functional failure as well as a diversity of development activities required to achieve demonstration of our technology. Despite renewed COVID related lockdown and restrictions the objectives were mostly achieved within the projected timeline. ..."

Again, no elaboration on the capabilities of the demonstrator units. It is clear that these demonstrators do need packaged chips to play outside the cleanroom, so presumably this means they must be able to address MEMS device dies that are still on a wafer held in the cleanroom. That restricts them to the ambient noise that is inevitably present in the cleanroom.

"... As informed previously, demonstration outside the cleanroom as well as compiling performance data in accordance with industry practices necessitates the chips to be assembled and packaged. ..."

It is unlikely they will provide more info on this so we will be left guessing again until they have the chips packaged.

Communications is always very guarded from AKP. Not sure if this is deliberate policy for good reasons or just poker playing habits.

Despite this we are encouraged to accept that they are doing everything that can be done, and doing it as quickly as it can be done.

Them's the breaks. At least there is no bad news.