I suppose my questions with the above in mind are:
- do RAD hardened chips factor into what Vorago sends to Soconet to TSMC?
- how do the enhancements affect the testing already done from already validated/tested chips from 2020?
- Do they fabricate what they've already tested in this year's scheduled run and leave the enhancements to next year's/following fabrication run?
2021 BRN Discussion, page-5856
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