Ann: Market Update - Progress Report, page-21

I believe it’s been very clear since the last meeting. The more advanced chips were described and illustrated in unprecedented detail there; as I understand it they’re the ones with the redesigned ‘square’ pixels, and will produce a higher sound pressure ratio, etc.
And I believe they’ve worked out with the previous chips how to package them manually without damaging them, so now it should be a straightforward task to first TEST the new chips, and then to at least build up a limited number of multi-chip demonstration packages.
However, having determined that manual wafer separation and packaging isn’t practicable for quantity production, there’s still the challenge to design and build automated apparatus for this - and I think they want to keep this task in-house in Tel Aviv for the time being.
(All imho: BobF will correct me as necessary, lol.)