4DS - Anything but Charting, page-18553

I think it is very positive that the speed increase for read is now an order of magnitude better and that it supports the smallest geometries which will better more power efficiency and greater densities. Absolutely happy about that. The biggest risk though is that they are allowing competitors time to catch up, it will be at least another year at best to resolve these assuming the next wafer run will take them 6-9 months to do.

On the tech side they never said what the manufacturing issues was, as 4DS would have been involved in specing the process, so while it may have been a manufacturing issue it does not mean it was actually IMEC's error IMO, since I do not know for sure it is just speculation though.

The main bug bear for me with 4DS is the lack of transparency with shareholders. So shareholders bear more risk due to a lack of really knowing what the companies situation is.