Thanks Deena, appreciate that. I'm hoping to pass my Monday test yet.
So the 2PL provided demonstration of the scalability down to smallest geometries supported + demonstrated the ability to do cell switching with an access device. If our goal is to sell this thing on a MB basis we need to get this step done. But that's not enough, maybe to prove it's worth shitloads. We need some NPL's to test more edge cases to see what else we can add to the recipe before we send it to Maggie Beer for final bake.
The 3NPL allowed 4DS to repeat prior speed, endurance, retention as per 2PL. But also added for the first time some special sauce (poss from the sauce boi himself) in the form of fully crystalline PCMO at a good heat. This allowed us to prove a new order of speed uplift and seems to me as though it relies on previous (or concurrent) step re access device or consolidates learning in that area (access device role in characterisation) to conclude our recipe formation.
Now we've got a recipe that's worth taking into the oven for the final run to get full characterisation. We've now got size, speed, retention and endurance, and access device packaged up. If we had have made our run for MB before now we will have missed a few tricks (and poss $b's).
But now we're ready to go and it's a MB.
Sadly the roadmap for 4DS ends when a MB chip is baked and the data is shared with people who are interested in this type of baked goods. We have developed a production-compatible process for the 4DS Switching ReRam in collaboration with IMEC using the same state-of-the-art process equipment used by people who make these things.
Now we just need a 4DS MB Memory and a spreadsheet to send around on unencrypted email to our mates at various locations, hopefully including some bois who share it with us via sauce bottle. If the MB chip bake kicked off back in August or even Sep it could be on the tray by now and you don't need IMEC's SOTA fab for a spreadsheet do you. Adieu and farewell. We'll miss the waffles.
Stick a fork in her 8ey she done.
