AGM Questions, page-323

From the last meeting, I have the following two questions for the next AGM;

1) The board has stated that they will disclose metrics under NDA to both memory makers and memory buyers, with a view to determine the market value of the technology under a competitive bidding process. Will the board also facilitate the purchase of the technology by a consortium of two or more non competing buyers? (For example a consortium of Western Digital and Samsung would use the technology for different purposes and may pay more together in a joint venture than a single buyer.)

2) Is the performance envelope of 4DS reram wide enough for memory users to have multiple applications of the technology in the one device? I.e. will one device have 2 instances of 4DS memory: 1 fast memory card with low endurance and 1 slower memory card with higher endurance such that more of DRAM and Flash can be augmented by 4DS? Or, is this "multiple" applications in the one device, of tuned memory, unlikely?

Unfortunately, I was too slow (or too dumb) to think of this on the fly during the meeting.