Earth Mountain almost there, page-266

Fixing any flaws in the MEMS structural manufacturing will be an iterative process that the FAB will work on as the production parameter envelope is fine tuned in every measurable characteristic during each routine production batch. The chips will get better and better over time as they zero in on perfection. That is not unusual, as Danny Lewin has said repeatedly.

My assumption is that the testing process, whether it be manual and slow, or on-line and fast, will characterise any of these deviations from perfection. The software will then presumably automatically make all the adjustments as calibrations or will get pre- programmed into the ASIC as part of the initial setup of each finished chip.