Ann: Xped Signs MOU with US Listed Tech Giant-XPE.AX, page-3

•  Memorandum of Understanding signed with US LISTED TECH GIANT with respect to a potential business transaction
•  Technology and solutions covered in the proposal are to be tailored for the LARGE SCALE INDUSTRIAL MARKETS including INDUSTRIAL, TRANSPORTATION AND HEALTHCARE SECTORS
•  Opportunity to execute REVENUE SHARE AGREEEMENT
•  Chipset manufacturer pledges future access to CAPITAL via MARKET DEVELOPMENT
  FUNDING for Business Development and Marketing opportunities.
•  Both COMPANIES TO SHARE CUSTOMER TECHNOLOGY OPPORTUNITIES and lead and
  operate in SPECIFIC JOINT BUSINESS DEVELOPEMENTS EFFORTS for mutual benefit
•  XPED’S PATENTED ADRC SOFTWARE to be ported onto latest chipset developed for IOT
  DEVICES and applications

Rocket in flight baby