I found this article that delved into Intel's 3DxPoint memory.
http://www.theregister.co.uk/2015/07/29/having_a_looks_at_imtfs_crosspoint/?page=1
The people who wrote this article are also just guessing.
Asking what we know about Intel/Micron's XPoint memory announced yesterday is maybe the wrong question. What don't we know about it?
Here are a few mysteries:
It would be astonishing if the technology isn't ringed with patents. We also think it is highly unlikely that either Intel or Micron discovered the memory cell material with original research. It's more likely that one or the other has licensed or otherwise acquired existing technology.
- Is the technology patented?
- Have developers kept quiet for 10 years?
- What is the memory cell material?
- What is their selector material?
- What is the process used to switch the memory cell's resistance by applying voltage?
- What is the cell geometry size?
- How many dies can be cut from a 300mm wafer?
- What is the switching time for reads and writes?
- Why are there two layers and not three or four?
- What is the die footprint?
I don't know how hard the guys who wrote this article looked but where are the patents for Intel's 3DxPoint. Who invented it and who is behind the technology? How's this for a crazy theory. 3DxPoint will use Weebit patents. Intel have given away so little information it makes you wonder if they have a technology at all. Maybe they know its coming and they'll just buy it from us when the time is right.
Too much mystery around 3DxPoint. If they acquired the technology why don't they say who from or why can't the industry even guess the answer. That way we could look at the patents. There must be patents but who are the inventors.
The mystery mounts.
Eshmun
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