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Telink becomes a partner of Apple Inc., page-80

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    Ahh....the Intel/Telink/Xped and Apple/Telink/Xped consortia in the making"!

    It is no coincidence, imo, that on the day that Apple announced that Telink was one of 'a few' bluetooth partners for Homekit, Telink advertised for seven (7) new software and design engineers.  Massive growth in train. Already has 100 employees - 70% of whom have Masters or PhD's.

    Strategic partnership still in place with Intel confirmed.

    Cisco and Skyworth (huge Chinese Holding Company, including OEM's) in the mix as well.

    $10M revenue - and growing

    Details below:

    Telink Microelectronics (Shanghai) Limited jobs

    News from: College students employment guidance service center Published: 2016/9/7 14:50:07 Visits: 12

    1. Company Overview

    Telink Microelectronics (Shanghai) Co., Ltd. was established in June 2010, it is committed to the development of Sino-US joint venture RF SOC. Headquartered in Shanghai Zhangjiang Hi-Tech Park, respectively, with subsidiaries or offices in the United States, Taiwan and Shenzhen.

    The company's main business is the chip SOC (system on chip, also known as system-on-chip) design and sales, and provide relevant technical advice and technical services. The industries involved and have things, wearable devices, intelligent hardware, touch screen management. The company mainly sells chips in applications include wireless mouse / keyboard, intelligent remote control, smart lighting, unmanned aerial vehicles, capacitive screen / electromagnetic screen and so on.

    Telink major research institutions in the United States and Shanghai. Currently the company Total over one hundred employees, mainly from the US core staff senior IC design engineers, all with a high level of chip design capability and rich experience in chip design; more research and development team, graduated from famous universities, and more than 70 % of employees have master's or doctoral degree.

    2. Target Vision

    Things become the world's leading supplier of wireless connection chip
    With our products and services to improve the lives of people around the world
    Enhance the international competitiveness of China's semiconductor industry

    3. Industry Outlook

    If the Internet is the future of the industrial revolution of the greatest achievements of the 20th century it changed the world, then things will be one of the 21st century the most promising industry, it is the foundation of smart city, smart home to achieve, people will live in more intelligent environments. According to McKinsey & Company in October 2015 analytical report 2020 access networking equipment will have 26 billion to 40 billion, the wireless connection chip market capacity per year more than 2.5 billion US dollars .

    Things realization, thanks to a few basics: (1) connecting the chip low-power low-cost multi-node; (2) the end of the control hardware and software support; (3) research and development of terminal equipment....

    Telink microelectronic products which solves two problems: (1) connecting the chip low-power low-cost multi-node; (2) the end of the control hardware and software support... Telink microelectronics research and development of multi-standard chip coexistence, support for Zigbee, BLE Mesh, Thread, All agreements Homekit, is a "full Netcom" chips solve the problem of terminal devices using different protocols, and open up the phone and connect the terminal equipment of things saved.

    Telink has developed the chip:

    • The first-class enterprises employed by foreign-made chips Zigbee
    • The first paragraph is first-class foreign enterprises to adopt the BLE mesh made chips
    One of the world's largest chip company with more than ten million US dollars purchase price

    Telink Technology Licensing

    • The world's first Zigbee BLE (Bluetooth Low Energy) multi-mode wireless networking chip connected
    • Low-power Bluetooth ad hoc network (BLE Mesh) is a global technology leader

    Telink Microelectronics sales :

    • Owned GE, Cisco, Skyworth and other domestic and international brands customers
    • Worldwide customer base of more than one hundred
    • Establish a strategic partnership with Intel Corporation

    4. We need what kind of person? Companies hiring standard of talent?

    Basic requirements: trustworthy, serious and responsible work, there is a strong thinking and problem solving skills, good sense of teamwork.
    Employing the concept: We believe that employees are the internal entrepreneur, stressed people-oriented, continue to find talent, training,
    Encourage employees to earth and innovative.

    5. In the fierce competition in the industry, we have a core competency?

    There are highly integrated, high-performance SOC products, 100% independent intellectual property rights, a complete platform solutions
    Increasing quality customers
    Growing high-performance teams

    6. What can we offer you?

    Open and free office environment
    One mentoring
    Great colleagues / partners
    Comprehensive training
    Opportunity to fully show personal capacity, high-tech work
    More career development, the technology and dual-channel management class career rise mechanism
    Competitive salary and benefits

    7. Company Benefits

    Basic welfare: five insurance payments in the year-end double pay performance bonuses work bonus lunch allowance
    Daily care: annual medical staff birthday party New Year red envelopes reward marriage maternity free snacks and sports activities
    Paid annual leave up to 20 days / year

    For professional: electronics, microelectronics, information, software, computer and other related professionals, 2017 session of the Master's / Ph.D graduates.

    Jobs:

     Software Development Engineer (Bluetooth Low Energy BLE, Google Thread / 6LoWPAN, Apple HomeKit, Zigbee and other development) Location: Shanghai, Shenzhen
     RF / analog mixed-signal (RF / Analog) Design Engineer Location: Shanghai
     Communication algorithm / digital signal processing Engineer Location: Shanghai
     Digital signal (ASIC) Design Engineer Location: Shanghai
     Chip verification Engineer Location: Shanghai
     Digital back-end design Engineer Location: Shanghai
     Site technical support engineer (FAE) Location: Shanghai, Shenzhen

    Campus recruitment process: campus lectures, written test, the test side, issuing offer letter, signed a tripartite agreement, apply for household registration, entry formalities

    Note: the students outside to return to Shanghai to interview reimbursed travel expenses
    Contact information:

    Phone: 02120281118 Fax: 02150388081
    Address: Pudong New Area, Shanghai Zhangjiang high-tech park
    URL: http: //www.telink-semi.com

    Contact: Liu test test E-mail: [email protected]

    https://translate.google.com.au/tra...jiesheng.com/job-002-337-676.html&prev=search
    Last edited by vintage: 11/09/16
 
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