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Declaration Details
Listing Details
Product List
Column 1 Column 2 Column 3 0 Declaration ID D038562 1 Referenced Qualified Designs 92269 (Controller Subsystem) 92262 (Host Subsystem) 2 Company Telink Semiconductor Co. Ltd 3 Listing Date 2018-02-01 4 Specification Name 4.2 5 Wi-Fi Certification ID
Note: Products that have not yet completed the Bluetooth Qualification Process will not appear in public search results.
Product Name Product Website Product Category Publish Date Archive Date Model Number Subset ID Description 1 Telink SIG Mesh SDK http://www.telink-semi.cn/viewtopic.php?f=7&t=100 [/url] Software 2018-02-01 Telink Bluetooth Mesh Suite mesh_v1.0, Core Specification v4.0 or later, Node Role,ADV bearer,GATT bearer… 2 8269 dongle Home Environment 2018-02-01 C1T82A3 USB dongle with Telink SIG Mesh solution
Qualified Design:
Supported Layers
Column 1 Column 2 Column 3 0 QDID 106546 1 TCRL Version TCRL 2017-2 2 Product Type Profile Subsystem 3 Combined Designs 4 Design Name Telink Bluetooth Mesh Suite 5 Design Model Number Telink Bluetooth Mesh Suite 6 Design Description mesh_v1.0, Core Specification v4.0 or later, Node Role,ADV bearer,GATT bearer… 7 Hardware Version Number C1T82A3_V1.3 8 Software Version Number V2.0 9 Other References 10 View ICS Details
Referenced Qualified Design:
Supported Layers
Column 1 Column 2 Column 3 0 QDID 92269 1 Company Telink Semiconductor Co. Ltd 2 Qualification Assessment Date 2017-04-12 3 TCRL Version TCRL 2016-2 (Bluetooth 5) 4 Product Type Controller Subsystem 5 Combined Designs 6 View ICS Details
Referenced Qualified Design:
Supported Layers
Column 1 Column 2 Column 3 0 QDID 92262 1 Company Telink Semiconductor Co. Ltd 2 Qualification Assessment Date 2017-03-13 3 TCRL Version TCRL 2016-2 (Bluetooth 5) 4 Product Type Host Subsystem 5 Combined Designs 6 View ICS Details
Subsetted Qualified Designs
© 2018 Bluetooth SIG, Inc. All rights reserved.
Subset ID Project Name Subset of Date Created ICS
Melbourne, April 3, 2017 AEST (ABN Newswire) - Xped Limited (ASX:XPE) ("Xped" or "the Company") is pleased to announce that it has completed the Auto Discovery Remote Control ("ADRC") port to the Telink 8269 chip (TLSR8269F512).
Highlights
- Xped completes the Auto Discovery Remote Control ("ADRC") port to the Telink 8269 chip (TLSR8269F512)
- Telink and Xped continue to work together to jointly market this highly competitive solution
- Next stage has commenced to incorporate the function of BLE (Bluetooth Low Energy) pairing capabilities to meet Telink customer needs
- Xped continues to port software to other Global chipset manufacturers in response to the IoT market opportunities
- Xped platform enables significant reduction in development time for Tier 1 manufacturers requiring App's and Cloud Infrastructure
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- News: XPE XPED says Company and Telink Semiconductor (Shanghai) entered into agreement
News: XPE XPED says Company and Telink Semiconductor (Shanghai) entered into agreement, page-2
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