Really interesting article, I found the key word is "fully depleted silicon-on-insulator" or FD-SOI.This type of wafer is currently the new trend that everyone is going to do because they use the same EDA tooling and lower manufacturing cost.I also found this article which content lots of money from EU, some big names and the key date of 31/03/2019. At the moment, STT-RAM and ReRam are potential candidates.Hope that they choose ReRam
https://www.eetimes.com/document.asp?doc_id=1329820
Anyway, If anyone have a better search, please inform in here.
2018 EE Times Silicon 60, page-2
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