Ann: imec Collaboration Update, page-11

"The entire manufacturing process, from start to packaged chips ready for shipment, takes six to eight weeks and is performed in highly specialized facilities referred to as foundries or fabs.[1] In more advanced semiconductor devices, such as modern 14/10/7 nm nodes, fabrication can take up to 15 weeks with 11–13 weeks being the industry average.[2]"

https://en.wikipedia.org/wiki/Semiconductor_device_fabrication

hash, might be a bit of a stretch to complete by end of april. seeing as they are not packaging chips the duration should be lower than stated above.

my prediction from 4DS past performance is it will be approx 7 weeks.
iteration 2 took 133 days from initial analysis to the next lot of wafers being produced.
Ill assume the actual production time is the same for both iteration 2 and 3 and the time savings will be from the analysis.
assume on the latest iteration they completed the detailed analysis twice as quick, iteration 3 was done in 42 days. 20/2/19 - 2/4/19. so assume iteration 2 took 84 days. 133 - 84 = 49 days for production time.
Above all IMHO based on made up numbers DYOR.