4DS - Anything but Charting, page-510

4DS Memory is pleased to advise that imec has today commenced the processing of the next lot of 300mm wafers, being variations of wafer D17. The speed with which 4DS and imec have been able to determine the process conditions for this next lot of wafers, and commence their manufacture, is due to the invaluable data obtained from previous iterations.

The above statement is all the news we need. It's very clear that it's all going according to plan and heading in the right direction.

The 20 different varieties of D17 wafers will be completed sooner than expected.