Packaging Facilities

At the EGM Yuval stated that Audio Pixels will be packaging their own chips when in production on the 12th of August AP shifted resources in this direction I will not be surprised if there is a capital raising before or shortly after a qualifying production run.
“Achieving a reliable fabrication process for the MEMS transducer has also enabled the company to shift resources toward efforts involving larger scale wafer production as well as the commercial packaging of the devices”