Here is a picture of various DIMM form factors with different DDR generations.
The 'vehicle' = the PCB (the green plastic shit)
Chiplets = cut, bonded and packaged wafer dies (the black plastic square shit)
As you can see, you could conceivably put the black shit on any shape of green shit.
The key is the technology inside the black shit.
4DS - Anything but Charting, page-8280
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