Ann: Company Update, page-78

Any wafers that were intended to be part of the Platform lot (if they were even started) would just transfer over to the Non-Platform lot.

So far as I know there is nothing different about a batch of wafers intended to remain wafers, and a batch of wafers intended to be cut and bonded to the "platform" (into a chip).

So unless there is something different with one of the masking layers or some final layer or some layer differences of design... then they would just use any wafers produced for the Non-Platform lot (or add them to the 23 planned Non-Platform wafers).

Whatever the situation, it sounds like they have found an opportunity to improve something in the mask layer design and/or some processing method that will specifically be useful for once the wafers are cut and bonded.