Ann: Appendix 4C - quarterly, page-217

Agreed on all counts.
Being packaged -> delays possible.
I am assuming chips will be sent back to Tel Aviv first for testing and evaluation in house -> delays possible, and an announcement could and ought to be made if problems encountered here.
Specs to be prepared after testing and evaluation. This is likely to lead to the first announcement. And it should be a good one.
While the dates were based on the best info available at the time I will be very pleasantly surprised if they actually work out to the timeframe. I imagine a delay of some sort ought to be allowed for and almost taken as a given. The longer the delay the better I would expect the news will be. Maybe.