I like it!
Packaged chips to be received imminently, which will be immediately installed into demonstration devices.
More finished chips to be received from this week onwards.
No mention of quantities, but this is probably only a small volume demonstration batch.
No comment either about these chips needing to be QC tested for a period etc - straight into devices ready for demonstration. That implies that QC testing may have been done step by step both at the wafer level on the production line (as already described), and again at the packaged level. As I understand it it is only finished chips that could be used to provide the full performance data for the market. It may be that such data could better be, or needs to be, obtained using the demonstration devices.
Here we go!
Well done to the teams in Israel and in Sydney.
Fred must have had a little smile of satisfaction as he was able to lay the first ace in his hand down this morning!
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