Ann: 4DS receives imec wafers, page-67

happy

From 1 Nov 2017 Ann:

As world leading research and innovation hub in nano-electronics and digital technologies, imec has the same state-of-the-art process tools for 300mm wafers that are used in high-density high-volume production fabs and engages in development with global makers of high-volumes high-density memories. Under this agreement, 4DS will collaborate with imec to develop a production-compatible process for the 4DS Interface Switching ReRAM technology to facilitate future transfer of the 4DS technology to any production fab.

There has been nothing to suggest imec's environment is no longer fab-compatible.