Aye, and neither are the laaads over aaht John Western Digital... aka HGST B.V, Inc & technologies...
So when Guido says "the partnership with HGST has allowed 4DS to expedite the pathway to commercialisation and has meant that it hasn't had to develop gigabyte prototypes" I think I can now see what he means....
Anyone wants to know if it stacks on debut, just ask Dan the Man.... Coz if he says it does then I'd say it does :-0)
Applicant Inventor Relationship Date Desc 1 HGST Inc CACHE US - 28.08.2018 14.10061775-SCALABLE AND PERSISTENT L2 ADAPTIVE REPLACEMENT CACHE 2 HGST Inc Daniel Shepard ECC US - 08.03.2018 20.20180069573-INCREMENTAL ERROR DETECTION AND CORRECTION FOR MEMORIES 3 HGST Netherlands B.V Reram US - 28.12.2017 35.20170372781-BI-DIRECTIONAL RRAM DECODER-DRIVER 4 HGST Netherlands B.V MRAM US - 21.12.2017 38.20170365777-SOT MRAM CELL WITH PERPENDICULAR FREE LAYER AND ITS CROSS-POINT ARRAY REALIZATION 5 HGST Netherlands B.V Reram US - 09.11.2017 44.20170324033-DIFFUSED RESISTIVE MEMORY CELL WITH BURIED ACTIVE ZONE 6 HGST Netherlands B.V Reram US - 26.10.2017 49.20170309332-PLANAR MEMORY CELL ARCHITECTURES IN RESISTIVE MEMORY DEVICES 7 HGST Inc Daniel Shepard Reram US - 21.09.2017 60.201702714073-D PLANES MEMORY DEVICE 8 HGST Netherlands B.V ECC US - 14.09.2017 64.20170262332-REDUNDANCY OF ERROR CORRECTION ENCODED DATA IN A STORAGE SYSTEM 9 HGST Netherlands B.V CACHE US - 18.05.2017 100.20170142217-SYSTEMS AND METHODS FOR ADAPTIVE PARTITIONING IN DISTRIBUTED CACHE MEMORIES 10 HGST Inc Daniel Shepard Reram *** US - 11.05.2017 101.20170133435-METHOD FOR FORMING PCM AND RRAM 3-D MEMORY CELLS 11 HGST Netherlands B.V ECC US - 27.04.2017 104.20170116060-ERROR LOCATION POINTERS FOR NON VOLATILE MEMORY 12 HGST Netherlands B.V ECC US - 11.04.2017 107.09620227-CHARACTERIZING AND OPERATING A NON-VOLATILE MEMORY DEVICE 13 HGST Netherlands B.V CACHE US - 30.03.2017 109.20170093426-CACHE OBLIVIOUS ALGORITHM FOR BUTTERFLY CODE 14 HGST Netherlands B.V MRAM/RERAM US - 23.03.2017 SELF-RECOVERY MAGNETIC RANDOM ACCESS MEMORY UNIT 15 HGST Netherlands B.V CACHE US - 09.03.2017 114.20170068623-INVALIDATION DATA AREA FOR CACHE 16 HGST Inc Daniel Shepard RERAM 4F2 *** US - 02.03.2017 120.20170062432-4F2 SCR MEMORY DEVICE 17 HGST Inc Daniel Shepard NVM-MASK Step US - 01.12.2016 143.20160351627-EMBEDDED NON-VOLATILE MEMORY 18 HGST Netherlands B.V ECC US - 25.08.2016 159.20160246670-ERROR CORRECTION FOR NON-VOLATILE MEMORY 19 HGST Inc Daniel Shepard Reram *** US - 28.07.2016 167.20160218147-METHOD FOR FORMING PCM AND RRAM 3-D MEMORY CELLS 20 HGST Netherlands B.V CACHE US - 21.07.2016 169.20160210232-CACHE COHERENCE PROTOCOL 21 HGST Netherlands B.V ECC US - 14.07.2016 170.20160203041-TRACK ERROR-CORRECTING CODE EXTENSION 22 HGST Netherlands B.V ECC US - 09.06.2016 175.20160162352-SYSTEMS AND METHODS FOR ADAPTIVE ERROR CORRECTIVE CODE MECHANISMS 23 HGST Netherlands B.V CACHE US - 14.04.2016 188.20160103765-APPARATUS, SYSTEMS, AND METHODS FOR PROVIDING A MEMORY EFFICIENT CACHE 24 HGST Inc Daniel Shepard Reram array*** US - 25.02.2016 204.201600562063-D PLANES MEMORY DEVICE 25 HGST Inc Daniel Shepard ECC US - 21.01.2016 205.20160019112-INCREMENTAL ERROR DETECTION AND CORRECTION FOR MEMORIES 26 HGST Inc Daniel Shepard NVM-MASK Step US - 21.01.2016 206.20160020253-EMBEDDED NON-VOLATILE MEMORY 27 HGST Netherlands B.V CACHE US - 21.01.2016 207.20160018988-IMPLEMENTING ENHANCED PERFORMANCE WITH READ BEFORE WRITE TO PHASE CHANGE MEMORY TO AVOID WRITE CANCELLATIONS 28 HGST Technologies CACHE US - 10.09.2015 229.20150254185-SYSTEM AND METHOD FOR CACHING VIRTUAL MACHINE DATA 29 HGST Inc Daniel Shepard Mem Array*** US - 04.06.2015 238.20150155033-OPERATING A RESISTIVE ARRAY 30 HGST Technologies CACHE US - 27.11.2014 252.20140351498-SYSTEMS AND METHODS FOR READ CACHING IN FLASH STORAGE 31 HGST Inc Daniel Shepard Mem Array US - 30.10.2014 254.20140321190-VERTICAL SWITCH THREE-DIMENSIONAL MEMORY ARRAY 32 D Shep Daniel Shepard Mem Selector US - 19.04.2012 282.20120096331-MULTIPLE SECTOR PARALLEL ACCESS MEMORY ARRAY WITH ERROR CORRECTION
In total over 238 HGST patents, though not all specific to 4DS... Some are just the "The Dige" de-bottlenecking a little.. hehe ;-)
HGST Inc Daniel Shepard Reram *** A method for fabricating 3-D cross-point memory arrays, and more particularly to fabricating phase change memory (PCM) and resistive RAM (ReRAM or RRAM) 3-D memory arrays having a cell size footprint of 4F2. The method for forming a plurality of layers of memory cells using a limited number of photolithographic patterning steps is applicable to memory devices having single or multiple storage bits per cell, such as cells having anywhere from one to eight bits per cell or more. These bits are stacked three dimensionally and include memory cells based on phase change material, on resistive change material, on magnetic field alignment, on mechanical switching, and on other memory cells based on other information storage technologies. 1 HGST Inc Daniel Shepard RERAM 4F2 *** A memory-array is disclosed in which an array of threshold switching devices is constructed having an area per transistor of 2F2. This array of threshold switching devices is suitable for a variety of memory or other applications including PRAM, MRAM, RRAM, FRAM, OPT-RAM and 3-D memory. 2 HGST Inc Daniel Shepard Reram array*** The present invention is a means and a method for manufacturing large three dimensional memory arrays. The present invention is a means and a method for addressing the WL and BL resistance by creating arrays having not only large plane conductors for each of the memory layers (WLs) but also for the opposite polarity common layer (BL). The present invention is also a means and a method to form via interconnections between the substrate logic and the respective layers of a multidimensional array. The present invention is also a way to operate an array in which the select device is unipolar but the array is above to be operated in a bipolar way. This facilitates a bipolar operation for memory cell technologies such as Resistive RAM (e.g., RRAM, ReRAM and Memresistors). 3 HGST Inc Daniel Shepard Mem Array*** The present invention is a means and method for constructing and operating a 3-D array and, more particularly, a 3-D memory array. This array can be manufactured as a monolithic integrated circuit at low cost by virtue of the limited number of steps per layer of memory elements. The low number of steps results by having the storage elements separated by a resistive component as opposed to an active component. The 3-D array is in essence, an array of 2-D resistive arrays (row-planes) having a long dimension (typically along the rows) and a short dimension (typically in the direction of the stacked layers). Any one row-plane can be isolated from the rest and be accessed independently from all of the other row-planes in the 3-D array. This makes it possible to operate and analyze a single row-plane as a mostly stand-alone circuit. The present invention lends itself to single bit accesses as well as simultaneous multiple bit accesses.
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