Just tying up a loose end on the IBM/Nanodx tech with the help of this paper:
The figure below from the paper does a great job at showing the two basic approaches to SiNW sensor manufacture, and how Nanodx thinking evolved. The Bottom-up approach was represented in Sampson's slide deck for the original TBit product - note the growing of nanowires and the placement as in the slide.
The top-down approach is what IBM have perfected and is what Sensera is implementing based on etching out the nanowires. The reference to "Mass production" is the important bit, and why the IBM contrinution was so critical.
All makes sense now.
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