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12:13
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Originally posted by xray1:
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Nissan GTR ............... It is still my view that there was only a " PARTIAL " failure last time round which imo I think may have been mainly due to IMEC production issues that arose during fabrication and IMEC providing wrong information ..... so I am now hoping that both 4DS & IMEC have got together to resolve all production issues this time round. I also take the view that IMEC will surely want to save face for what had previously transpired and make sure that a fully functioning chip to full Co expectations is achieved ......... and thus this is part of the reason why imo 4DS is now in the position/required to acquire new testing equipment to assist in obtaining useful technical data,facts and figures ready in anticipation of commercialisation to market or maybe possibly even a WBT buy-out.
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4DS reram when it arrives is a WBT wipeout.
(20min delay)