Ann: 4DS Technical Update, page-295

From my standpoint, the focus is no longer about achieving the megabit chip, this was confirmed to happen when 4DS declared it successfully completed the required manufacturing steps in the short-loop study without pushing out the July out-of-fab schedule.

The question I have now is, how much of the $105B USD DRAM market will 4DS augment or disrupt with it's "unique" Non-Filamentary Interface Switching ReRAM technology?

We are coming out of imec with characteristics that exceed storage class memory requirements and on the "smallest geometries" that "imec supports" on its 1Mb 300mm production fab qualified chip (possibly 14nm, 10nm, 7nm, 5nm).

We are also coming out of imec with Endurance being serveral orders of magnitude better than NAND and speeds that is comparable to state of the art DRAM "DDR6/DDR7" without the need of speed crippling Error Correction. The very same Speed was again improved by an order of one magnitude and then again improved by another order of one magnitude (surely at this point we would be faster than state-of-the-art DRAM).

Importantly we are also coming out of imec with technology that is "fully" compatible with state-of-the-art high volume DRAM and NAND production fabs. 4DS Memory production material had been qualified by imec and requires zero retooling.

Industry experienced Dr WvdH and Ken H will not find it difficult to secure a multi billion dollar (USD) deal with one of the industry giants like Samsung, Micron, Intel, Western Digital, SKHynix, Qualcomm and so on.

Dr WvdH did mention at the vAGM that he will release the metrics post out-of-fab schedule but also mentioned that if 4DS is acquired before then, it will be up to the acquirer whether they will want to release the metrics.

Mega Re-Rate initiated.