at the base level the root cause will discover the pcmo under transition from the rapid thermal processing (IMEC RTP chamber) 'bake' vacuum to stable atmospheric conditions results in substrate bond oxidisation resulting in unpredictable production variations....specifically reproducibility and uniformity .... as we now know per last announcement.
the solution is a redesign of the critical parameters of manufacturing process ( the 3 step baking process combined with the spin coating Pr Ca MnO to the design thickness - post bake annealing combining the pcmo and the substrate and the top electrode installation. root cause ?....first and foremost the error must be repeated under manufacture before any other decision is taken.....is this occuring?
this is not a quick turn around no matter what some of the commentary may state.
the company needs to make this clarification clearly to the market imo....the silence is deafening imo glah
4DS Price at posting:
3.2¢ Sentiment: None Disclosure: Held
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