Ann: Quarterly Activities/Appendix 4C Cash Flow Report, page-396

New Patent granted for Earth Mountain:

The invention discloses a chip packaging structure, a loudspeaker and a chip packaging method, and relates to the technical field of chip packaging to solve the problem of high chip stacking. The chip packaging structure includes a substrate, a cover assembly, a first chip and a second chip, the substrate has a mounting groove, the cover assembly is connected to the substrate and encircled to form a cavity, the mounting groove is located in the cavity, and the first chip is located in the mounting groove Inside, the second chip is located in the cavity, and the second chip is composed of a first part and a second part, the first part is located on the part of the substrate not provided with the installation groove, and the second part is located on the first chip. The loudspeaker includes the chip packaging structure mentioned in the above solution. The chip packaging method uses the chip packaging structure proposed in the above solution.

Published Friday:

Once again China only:

App Num:CN202211436354.1