Ann: Further Significant Megabit Success, page-890

Bards AI answer

ReRAM based on filament creates more heat than ReRAM without filament like 4DS.

The reason for this is that the filament in ReRAM is a highly resistive material. When a voltage is applied to the filament, it heats up due to Joule heating. The amount of heat generated is proportional to the square of the current flowing through the filament and the resistance of the filament.

In ReRAM without filament, there is no single high-resistance element. Instead, the resistance of the ReRAM cell is determined by the properties of the entire dielectric material. This means that the current flowing through the ReRAM cell is more evenly distributed, which reduces the amount of heat generated.

In addition, the filament in ReRAM is a very thin structure, which means that it has a high surface-to-volume ratio. This makes it difficult for the heat generated in the filament to dissipate to the surrounding material.

As a result of all these factors, ReRAM based on filament is more prone to heat generation than ReRAM without filament like 4DS.

Here is a table that summarizes the key differences between ReRAM with filament and ReRAM without filament:

Characteristic	ReRAM with filament	ReRAM without filament (e.g., 4DS)
Resistance	Highly resistive filament	Variable resistance depending on the properties of the entire dielectric material
Heat generation	High	Low
Surface-to-volume ratio	High	Low
Heat dissipation	Difficult	Easy