2023
Key Highlights
To Date
• Renewed technical progress update
• Granted 34th USA Patent
• Placement for $5.5M completed
• HGST renews for 10th consecutive year
• imec shipment of Fourth Platform Lot
• Megabit success with the Fourth Platform Lot showing a fully functioning megabit array with 60nm memory cells, access transistors and write circuitry
Next Steps – Demonstrate a megabit memory in a production-compatible process
• Develop a production-compatible process for the 4DS Interface Switching ReRAM technology in collaboration with imec using the same state-of-the-art process equipment currently in use by high-density high-volume memory makers.
• Demonstrate this production-compatible process with imec’s proven memory platform to build a 4DS megabit memory.
• Collect statistical significant data for yield, speed, endurance and retention at the megabit chip level that high-density high-volume memory makers & buyers need know to make informed decisions.
