4DS and the new Canon technology to compete with ASML, page-4

howie , in all Sincerity and practicality

i offer a very simplistic explanation of two comparing technologies
repeat Very Simplistic

3 images below

1* block of chocolate representing the Processed Wafer the indentations represent the etch ( which will hold the circuitry )

2* the 4ds imec method of achieving the grooves the etch in the wafer ( in laymans term like an engraving )

3* the Canon method you speak of uses a Stamp Process to achieve the grooves ( or the etch ) in the Wafer

again a Very Simplistic Comparison of 2 different
technologies used in the chip manufacture process

hope this help you a little

4ds & imec ate using the 2* process


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