Ann: Continued Suspension from Quotation, page-83

I think the June in question was last June. There have been many references to the 'chips' having being expected towards the end of 2023. No packaging plant -> no 'chips'. We have seen images of Danny Lewin and Yuval Cohen cutting ribbons at the opening ceremony of this packaging plant. In the recent 4C for Dec 23 this was reiterated, with chips first being expected in Q1-24. While we have gone past this timeline (again) this outcome is still only possible if EM can package the finished dies from approved wafers into chips. So again: no packaging plant -> no chips. It is feasible that the packaging could be done elsewhere, but that is not what we have been repeatedly told by AKP.