don't see any negative impact for emass imo - the opposite is perhaps more likely
very different 'material' technology at play
4ds are in the process of attempting to prove out the manufacture of a phase change memory -pcmo- and essentially keep hitting the same wall where mask/etch causes dimensional change in the material and the component constituents - this has occurred on 3 production lots over a couple of years and is proving a very difficult fix.....even after deep and extensive failure analysis
my personal opinion is they will need to re engineer the whole memory stack config to get any sort of working / industry ready memory at 20nm which is the commercial node that makes the tech viable in the marketplace....that is another 2 yrs away and 2 additional test lots
Emass is proven and benchmarked to top tier industry performance metrics with working chips out for evaluation by independent companies - mou's and orders are not far away imo
just my take dd
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