It is possible that they are doing their evaluation in parallel while the company is doing theirs.
My understanding of the extra work, is the firmware that needs to be written for the drivers etc..
There is always tuning that will be needed both now and in the future, so I have little concern about this.
The chip has been designed to be extremely configurable and flexible, including the ability to connect may chips in parallel.
To achieve this you would need software on the chip and a way to communicate with this software to change the configuration.
If you think about a potential customer, they would probably only use the chip in one particular configuration. So some configurations may need minimal or no additional software to function, may be the UNI is testing this?
2020 BRN Discussion, page-11961
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