They do not mention latency but I suspect it is implied in the comment that the Ai should be as close as possible to the sensor. This obviously reduces latency but it also overcomes jamming of signal in battlefield scenarios or interference from otherwise noisey environments which clearly a battlefield would be.
A hardened AKD1000 chip capable of resisting radiation and temperature extremes would be at a huge advantage in such situations.
The CEO’s comment “we certainly have a lot going on in that area” is starting to disclose itself.
2020 BRN Discussion, page-8937
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