Thank you for reminding me to check the current EM website. Here are some highlights there. (I note no mention of 75 million chips pa - and the final sentence is significant.)
DIGITAL MEMS SPEAKER
Breakthrough innovations in sound reconstruction, use MEMS array to reproduce sound.
Efficiency > 30%
High sound pressure level, compatible with wider range of application
Size：9.8 x 9.8 x1 mm
Frequency range：20 Hz-20K Hz
Market: Replace the traditional speaker Market
Cost: low：20 Hz-20K Hz
Listen to the future… with the chip
THE FIRST DIGITAL MEMS SPEAKER
The Innovative Products
A chip that can playback sound
Perfect sound quality, even the smallest details
From analog sound to digital sound
From assembly manufacturing to semiconductor manufacturing
Replace all traditional speakers
Bring you unimaginable innovative applications
Technical Highlights
Excellent impedance matching, maximizing electro-acoustic conversion efficiency, compared with traditional speakers of the same size, SPL (sound pressure level) significantly improved;
Composed of thousands of miniature vibrating units that perform the same movement, only the number of motion units needs to be controlled;
Superior performance, wider frequency range, flatter frequency response curve, less distortion, much lower than human ear perception;
Low power
PACKAGE FACTORY
Company is now building a packaging factory with an annual production capacity of 50 million chips, the factory with a total area of 5000 square meters, located in Suzhou Changshu city, close to the Yangtze River, includes an automatic MEMS package production line, acoustic laboratory, application laboratory, product quality test, and other functional laboratories. The factory is now undergoing internal decoration, which is expected to be put into use in the second quarter of 2023.
(20min delay)