2024 2H CHART THREAD, page-29

  1. 5,230 Posts.
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    perfect sense imo
    looking forward PL6 needs at a minimum some functional cells that deliver PL4/5 performance with an improved (stable) retention window (minimum ion/oxygen diffusion across switching cycles between lrs and hrs )- this will provide better data on endurance metrics and allow infineon best case metrics to run the platform design.
    Most likely they have already matched the back of the envelope rough out with the data imec have gathered across PL4/5 + redesign for the 'shortcomings' of the universal platform inconsistencies( lets call them) and have simulation iteration models in mind for the design
    they still need 20nm to be as imec expect it to be as any additional manufacturing inconsistencies that arise in 20nm uniquely will cause a rethink across the board ( as likely as not imo) ...

    who approached who - non question in my mind as it is a fee for service contract with a top tier entity who understand reram ( long time collaboration with tsmc in the automotive mcu reram space )

    imo PL7 and 8 are in the picture whether or not 6 is a pass or fail cause the manufacturing repeatability / reproducibility / defect density - yield numbers / qualification process etc are not transferable node to node particularly in a new 'material' and in an emerging technology

    the 'bod' here in its current structure is not capable of driving success imo as past performance clearly indicate but imec / Ting process development keeps me holding for now - 20nm success is a must as it will validate their intense work and perhaps confirm a pathway forward and restore some value to the sp

    I believe a 'premium' sale is a way off yet and time is now a key factor in the equation

    this is just my opinion though R2D2 and one of many here

    level of success for 20nm/PL6 is the value catalyst that matters now ( as we know but can't say it any other way)

 
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