Lets compare the Difficulty of manufacture of the new ReRam Memory chips against that of the current Flash memory available
It appears the that is much more involved in manufacturing Flash memory with 26 additional manufacturing steps required than that required in the manufacture of ReRam. So Flash requires 30 steps above Cmos 4D-s' ReRam
requires only 4 steps.
4D-S goes on to state that the manufacturing process only requires low temperatures to deliver. I read into this that Flash must require a high temperature process, potentially much more costly on a large scale.
FRY Price at posting:
5.6¢ Sentiment: Buy Disclosure: Held
