I mean that the wafer fab must be able to bang out lot after lot without endless finicky adjustments to process parameters in order to get working parts.
I'll pass on giving technology comparisons for reason given before.
Some patents here if you want to check out IP:
http://www.faqs.org/patents/assignee/4d-s-pty-ltd/
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I mean that the wafer fab must be able to bang out lot after lot...
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