still flogging this horse hey howie ,
this is a technolgy that STAMPS the wafer & is still in its evolution
& is NOT a good fit for 4ds
again i will example the Cosequences of Contamination & Debris on Pl3
And again you suggest this technolgy as a solution for 4ds
a technolgy that has a high inherent ability to contaminate the wafer through the stamping process .
and is a small scale process Not a High Volume Mass Production Solution ..
what are you not understanding ?
perhaps wait for the outcome of Pl 5 & 6 from imec
good luck pal
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still flogging this horse hey howie , this is a technolgy that...
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