Hola Amigo y muchas gracias por la perlicula... No Apologies req good Sir.. Not seen &/or heard it and note a couple of key points for me.
WDC, INTEL & SAMSUNG (DM's Words) are already there at IMEC... NDA or not, they'll all know what is happening and hence I don't know if they will need to prove another run... This will be 3rd time for the data metrics and applying the logic control aspect by understanding was basically seen as a fail free process once the hard work was done.
Still believe it gets sold twice, anyone else care to think differently??... Better get two forks Jerry hehehehe
Thanks for the tips DM me old mate, ya must have needed the cash is all I can say.... Cheers Brother 
8tey Interviewer monologue
0.31s 4DS is a technology company taregetting "The Holy Grail" of memory tech with something called storage class memory
0.39s The comopany recently locked down it's 30th US patent as it seeks to develop an ultra fast, near instant memory chip that could one be used in devices all around the world.
0.46s The company has enjoyed a couple of solid long term partnerships, one with Western Digital for the development of its technology and another with IMEC to provide proof of concept.
And what makes 4DS technology different than what is out there now?
1.05s (DM)At the moment we use two types in our daily lives at the moment
in our phones and on our devices 1 is called Flash (Stored Memory) which is quite slow and the other is DRAM (Operating System Memory) & that is really fast so what the industry is looking for is something which has the combination of both those technologies, which is something that is really fast with the ability to store information (The Holy Grail) and that is the technology we have been working on with Western Digital & IMEC over the last 7 - 8 years
"what the industry is looking for is something which has the combination of both those technologies, which is something that is really fast with the ability to store information (The Holy Grail) and that is the technology we have been working on with Western Digital & IMEC over the last 7 - 8 years"
Interviewer:
Ok, well tell me about Imec, who are they & what they bring to the table for you?
1.35s (DM)IMEC are the pre-eminate semiconductor development company in the world.. They are not for profit so they are not physically driven by contract revenue. What they are looking for is unique world beating technology and so
all the leading semiconductor companies are there. So WDC is there, Intel is there,
Samsung is there and so we are priveliged to be able to work with them and importantly they have production equipment there so we can show all the chip manufacturers that if we can make it work on IMECS equipment then we can make it work on theirs.
Interviewer
And how's that partnership going, have there been any major achievements to date?
2.08s (DM)Yeah, in the middle of last year we announced the most successful results we had to date and we backed them up with a repeat which we announced this year and currently we are back on their production equipment producing more wafers which we will have results of in (2) Q2 this year.. Maybe a slip in which he nearly says two weeks (hard to tell on the sound quality) ???
| Ticker | NAME | POSITION | COMPANY | RELATIONSHIP LIKELIHOOD | CONNECTION TO WILBERT |
|---|
| 1 | OSC | Hassane El-Khoury | President & Chief Executive Officer | ON Semiconductor Corp. | STRONG | Cypress Semiconductor Corporation |
|---|
| 2 | Entegris | Chris Kramer | Former Senior Vice President & Chief Commercial Officer | Entegris, Inc. | STRONG | Intermolecular, Inc. |
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| 3 | NVDIA | Marvin D. Burkett | Former Chief Financial Officer & Chief Administrative Officer | NVIDIA Corp. | STRONG | Intermolecular, Inc. |
|---|
| 4 | SIA | George Scalise | President Emeritus | Semiconductor Industry Association | STRONG | Intermolecular, Inc. |
|---|
| 5 | OSC | William L. George | Former Executive Vice President-Operations | ON Semiconductor Corp. | STRONG | Cypress Semiconductor Corporation |
|---|
| 6 | Ramtron International Corp. | Bradley W. Buss | Secretary & Director | Ramtron International Corp. | STRONG | Cypress Semiconductor Corporation |
|---|
| 7 | OSC | Sam Thad Trent | Chief Financial Officer, Treasurer & Executive Vice President | ON Semiconductor Corp. | AVERAGE | Cypress Semiconductor Corporation |
|---|
| 8 | SK Hynix, Inc. | Oh-Cheol Kwon | Former President, Co-Chief Executive Officer & Director | SK Hynix, Inc. | AVERAGE | Cypress Semiconductor Corporation |
|---|
| 9 | Qualcomm Ventures | Quinn Li | Senior Vice President & Global Head of Qualcomm Ventures | Qualcomm Ventures | AVERAGE | Enovix Corp. |
|---|
| 10 | Ramtron International Corp. | William W. Staunton III | Former Chief Executive Officer | Ramtron International Corp. | AVERAGE | Ramtron International Corp. |
|---|
| 11 | Infineon | Klaus Fleischmann | Former Vice President-Business Development | Infineon Technologies AG | AVERAGE | Ramtron International Corp. |
|---|
| 12 | AMD | James E. Doran | Former Vice President & General Manager | Advanced Micro Devices, Inc. | AVERAGE | Ramtron International Corp. |
|---|
| 13 | Ramtron International Corp. | Eric A. Balzer | Former Chief Executive Officer | Ramtron International Corp. | AVERAGE | Ramtron International Corp. |
|---|
| 14 | AMD | Henri Pascal Yves Richard | Former Executive Vice President, Chief Sales & Marketing Officer | Advanced Micro Devices, Inc. | AVERAGE | Enovix Corp. |
|---|
| 15 | SPTS | Kenneth Aitchison | President, Chief Executive Officer & Director | Applied MicroStructures, Inc. | WEAK | Novellus Systems, Inc. |
|---|
| 16 | SPTS | Mike Khosla | Vice President-Engineering & Operations | Applied MicroStructures, Inc. | WEAK | Novellus Systems, Inc. |
|---|
| 17 | Intel Corp. | Adam J. King | Vice President, Client Computing Group & General Manager, Client Strategic Planning | Intel Corp. | WEAK | Novellus Systems, Inc. |
|---|
Drs. Wilbert van den Hoek, 4DS’ Chairman, commented “Industry players want to know that a new memory technology can be produced commercially, using industry standard fab equipment. 4DS is well advanced on this path, and the commencement of the Second Platform Lot is another significant step forward.”
| Key Market Players Profiled |
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| 1 |
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| 2 | Samsung Electronics Co., Ltd., | DRAM |
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| 3 |
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| 4 | Toshiba Corporation, |
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| 5 |
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| 6 | SK Hynix Semiconductor, Inc., | DRAM |
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| 7 |
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| 8 | Micron Technology, Inc., | DRAM |
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| 9 |
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| 10 | Intel Corporation, | FLASH |
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| 11 |
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| 12 | Apple Inc., |
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| 13 |
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| 14 | Lenovo Group Ltd., |
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| 15 |
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| 16 | Advanced Micro Devices, | FLASH |
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| 17 |
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| 18 | STMicroelectronics, |
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| 19 |
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| 20 | SanDisk Corporation | FLASH |
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CXL Framework
The Compute Express Link (CXL) is being developed to supersede the PCIe bus and is envisaged by its developers as making pools of memory (DRAM + SCM) sharable between CPUs and also GPUs; but not HBM.
ARM SoC
