Not a bad time to pitch an offer, what with all the winter sales...

Not a bad time to pitch an offer, what with all the winter sales on down Sth...

Feels somewhat like taking a leak outside Mawsons Hut at times with Doc Johnson registering wind chill well in the minus factor on even the quickest of squirts...

Still, there are some benefits left in Lat 40- living.... Cousin Mick with a nice little cooker....


SK Hynix boss predicts CPUs and RAM will merge, chipmakers will hold hands to make it happen
The CEO of SK Hynix, the world’s second-largest memory manufacturer behind Samsung, has tipped the merger of RAM and CPUs, and the rise of the Compute Express Link standard.
Delivering the keynote at the Institute of Electrical and Electronics Engineers’ International Reliability Physics Symposium (IRPS), CEO Seok-Hee Lee delivered his vision for the future of memory and the industries that rely on it.
“There will be a convergence of memory and logic,” he predicted. “The concept is to add a few computing functions of CPU to DRAM.”
“As the speed was increased in high-bandwidth memory by increasing the number of channels between the CPU and the memory, the speed will increase further in Processing Near Memory (PNM), where both the CPU and the memory exist within a single module.”
“The speed will further increase in Processing In Memory (PIM), where the CPU and the memory exists within a single package. Ultimately, speed will increase further in Computing in Memory(CIM), where the CPU and the memory is integrated within in a single die, to deliver high performance computing system.”
SK Hynix does not make CPUs and Lee didn’t even hint the company would do so.

March 25, 2021 C Mellor
A new memory hierarchy is emerging, as two recent developments show. In no particular order, Micron walked away from 3D XPoint and SK hynix revealed new categories and of memory product in a hierarchy of access speed. In both cases the Compute Exchange Link (CXL) is envisioned as the glue that links shared memory and processing devices such as CPUs, GPUs, and app-specific accelerators.

In explaining its decision to stop 3D Xpoint development and manufacture, Micron argued that there will be insufficient demand for 3D XPoint chips in the future because memory capacity and speed limitations will addressed by two technologies: High Bandwidth Memory (HBM) and CXL fabrics.



The Compute Express Link (CXL) is being developed to supersede the PCIe bus and is envisaged by its developers as making pools of memory (DRAM + SCM) sharable between CPUs and also GPUs; but not HBM.

Australian startup claims RRAM breakthrough
BY MARK LAPEDUS
Now, it is gearing up for the commercialization stage. ''4DS memory has the potential to replace all existing semiconductor memories and can be manufactured in a fraction of the process mask steps above standard CMOS as comparable memory technologies such as flas and DRAM,'' Pfluger said. ''The 4DS method uses existing semiconductor processes and requires fewer changes to the semiconductor manufacturing equipment, enabling simple manufacturing through a technology that can be scaled significantly farther than NAND or NOR flash.''


Pitt St Research mark Kennis
We believe the actual value of 4DS in a potential M&A deal (if and when that happens) could prove to be substantially higher to the right acquirer. To illustrate this point, we’ve looked at sales of 3D XPoint, an emerging nonvolatile memory technology developed jointly by Intel and Micron Technology.

Both companies have only started selling 3D XPoint in its current iteration in 2019 with Micron reportedly having achieved US$119M in 3D XPoint revenues in its 2Q20, which ended in February 2020, so roughly US$480m on an annualised basis.

Total revenues for 3D XPoint are expected to reach US$3BN by 2023 and US$16BN by 2029. In other words, Interface Switching ReRAM, which is technologically superior to 3D XPoint mainly due to better read/write speeds, would present a very substantial revenue opportunity in the right hands, i.e. existing players or challengers in the SCM space.

This potential should be expressed in any potential take-over bid for 4DS, in our view. Adding the potential of neuromorphic computing to the equation could lead to a substantially higher valuation for 4DS still.

We believe that 4DS is the only nonfilamentary ReRAM company with a global partner. The long lead times to develop such technology (10+ years), suggests that it is unlikely that there will be a short term challenge to the 4DS technology, which has been in development over the past decade, as the next generation non-volatile memory solution forecast to take US$6- 7b share of the US$40b Flash memory market by 2020.

And (as a superior product) if we can sneak on some of that old 3DXP revenue (circa $3B in 2023) that is now floating in a sea of broken dreams then it's possible Jasp could be a buyer of all of Tassie & the surrounding Furneaux Group... Plus I'll throw in Cousin Mick, a 14 foot tinny and a homemade hooker & a carton of cans for as many dive reccies on the Bass Strait Cray as you'd like.... hehehe

Western Digital Does Not Speak For Micron Aug. 18, 2020 10:00 AM
Micron (MU), Taiwan Semiconductor (TSM), Samsung (OTC:SSNLF), and SK Hynix (OTC:HXSCF) all had good things to say about the back-half of the year after an excellent first half. Micron sang datacenter, mobile, and console praises for a healthy second half and guided above consensus on its FQ3 earnings call. All of those verticals involve non-volatile memory and a lot of it. If you need a refresher:

Western Digital's Woes Aug. 18, 2020 10:00 AM ETMicron Technology, Inc. (MU), WDC166 CommentsStarting with mobile, the company doesn't have a presence worth mentioning, at least one it could capitalize on.
So as you know, we've been underweight mobile for quite a while.

If you're thinking about going long Western Digital, you have to consider these shortcomings.

It's hard to find a tech product where memory is not being added and expanded, this year especially - servers, smartphones, gaming consoles, GPUs, etc. More specifically, on the non-volatile side, which spans SSDs (solid-state drives) and HDDs (hard disk drives), there is a tremendous shift to more performance-driven SSDs and capacity expansion therein.

Now, who thinks "the dige" been playing hide the sausage with analysts over its new emerging tech..

SAN JOSE, Calif. — Startup 4DS Inc. has emerged from stealth mode and claims to have made a major breakthrough in resistive random access memory (RRAM) technology.

A number of companies in Europe, Japan, Korea and the U.S. are scrambling to develop RRAMs. 4DS claims to have beaten its rivals to the punch, by demonstrating RRAM cells and a process within its small-scale fab in Fremont.

European research institute IMEC has started looking at RRAM cells. Five of the leading memory makers–Samsung Electronics Co. Ltd., Hynix Semiconductor Inc., Qimonda AG, Elpida Inc. and Micron Technology Inc.–are involved in the IMEC core CMOS research program and are set to share the cost and benefit from the results of the research.

At 4DS, the startup is taking a different approach than IMEC, but it did not reveal its secret sauce. The startup was formed in 2007, after it acquired some technology from an intellectual-property (IP) house. At the time, 4DS obtained some funding from a number of investors in Australia and other regions.

The company is now looking for a manufacturing partner to bring its so-called ''4DS memory'' into mass production, said Kurt Pfluger, chief executive of 4DS. “It's a simple process,'' Pfluger said. ''This has the potential to replace DRAMs and flash.''


Now who's prepared to dip their toe in the water tomorrow...... ? hahahaha