4DS - Anything but Charting, page-19829

There are a number of ways to collaborate with imec:

1. Collaborative research

By entering one of imec’s research programs into next-generation semiconductor technology, you get privileged access to cutting-edge R&D results and share costs and risks with other partners.

Imec hosts research programs in domains such as:

• Advanced logic scaling, going down to 1 nm and beyond through innovative device architectures, new materials and STCO.
• Storage and memory solutions, improving density, speed and energy-efficiency by exploring new concepts for technologies such as MRAM, DRAM, NAND and 3D Ferroelectric FETs (FeFETs).
• 3D processing and integration, boosting densities and bringing down costs through techniques such as die-to-wafer bonding and wafer-to-wafer stacking.
• Deeply scaled interconnects, approaching and surpassing the 3nm node through process innovations, scaling boosters and new materials.
• Optical interconnects, leveraging our silicon photonics platform to provide cost-efficient I/O solutions at all levels of computer systems.
• Neuromorphic circuits, using analog technology and in-memory computing to perform faster operations on large datasets.
• Quantum computing, helping to overcome technological challenges, large-scale qubit fabrication, performance improvement and variability reduction of silicon and superconducting qubits, and 3D integration/packaging of cryocomponents.
• PPAC-E, assessing and reducing the environmental footprint of IC technologies.