https://stocksdownunder.com/video/4ds-memory/?utm_source=Facebook&utm_medium=Post&utm_campaign=Organic&fbclid=IwAR2EBJGIAQl1tqUZV59o9injJu-0MKdgjlj6Jmc4OA_ZehKWONOcw1b_5HISo in this (starting around 10min in) they state the issues were known in August when last update to market following the failled wafer batch, they said since then they were just outlining the path forawrd and working with IMEC to make a timeline for the next lots of work.
William goes on to say they were scheduled on 11th Oct to outline their plan to market and then IMEC notified them that they had provided 4DS the wrong information about why the last lot of wafers had failed and this would cause the next lot of wafers to fail. It then took 4DS and 3 weeks to work out a solution to the problem and the new contract terms arrangement then this is what will cause the three month delay to the timeline.
This all reads very differently to both the first failed wafer batch and to what they released to market with this "technical update" Why would they not be honest about that?
So before they can even go back in to wafer production to test they need to do some design work and unit process issues, so they are designing an entire new mask. Good luck with the 3 month delay they are estimating.
On the good side of things i think the problems can be overcome but now it is mostly a trust issue that they couldn't communicate any of this to investors and the technical update didn't mention any of this, add to this they certainly don't have the funds for this length of delay to July 2022
