I have had the same thoughts...looked back through 4DS site and...

I have had the same thoughts...looked back through 4DS site and found this analysis by TMT.

http://www.4dsmemory.com/media/files/4DS-Flash-Note-1-November-2018.pdf

The subject matter experts on this thread may have other opinions, but hope this helps



4DS’ design to be mounted on IMEC’s megabit memory vehicle

Once 4DS and IMEC complete the memory technology transfer to 300mm commercially
available semiconductor manufacturing tools, the next step will be to mount this memory
technology on IMEC’s standard megabit memory vehicle with all the required circuitry to
connect memory cells using 4DS’ interface switching ReRAM technology to the outside
world.
Integrating the memory cells with the megabit memory vehicle is done in back-end-of-line
(BEOL) processes, which is the latter stage of the chip manufacturing process. BEOL is not
to be confused with the back-end/packaging process, which involves cutting individual
chips from the wafer, soldering electrical leads and packaging them using black resin or
plastic.
Compared to transferring the core chip design from lab to fab, integrating this design with
IMEC’s megabit memory vehicle should be relatively straightforward given IMEC has done
this numerous times and the platform is a standard design.
It will require some rigorous testing, though, specifically for yield, speed, endurance and
retention. With all memory cells in a memory chip, they are accessible and testable at
standard memory speeds – rather than individually as is the case in 4DS’ lab setting.