4DS - Anything but Charting, page-25186

4DS Memory Fab Cycle Time

Based on the Second Platform Lot, It takes imec 140 days (20 weeks) to manufacture 4DS Memory Wafer.

If we look at the below geometries and the time it takes to manufacture, we can determine the memory cell size 4DS / Western Digital had adopted to fab qualify it’s technology using imec’s megabit memory array. (Western Digital took part in the development planning for the Second Platform Lot).

Most common metric for cycle time in a fab is “days per mask layer”. On average, a fab takes 1 to 1.5 days to process a layer. State-of-the-art fabs are down to 0.8 days.

28nm (40 to 50 layers) : 40 to 50 days
14/10nm (60 layers) : 60 days
7nm (80 to 85 layers) : 80 to 85 days
5nm (100 layers) : 100 days

imec taking 140 days to fab cycle 4DS Memory technology using “smallest geometries” supported on imec’s memory array would have to mean 4DS Memory are fab qualifying it’s memory cell’s at 5nm geometries.